公司已具备制造多层高密度线路板、柔性线路板(FPC)、刚柔结合板、陶瓷板.铝基板、高精度阻抗板，SMT贴片等特种电路板工艺制作能力。

并能提供专业线路板化金、电镀镍金、金手指、电镀软金、电镀厚金、化学厚金、化镍钯金、电镀纯锡、无铅喷锡和化学沉银等表面处理服务。

The company has obtained manufactuing capabilities for multi laye high-density PCBs, FPCs, Rigid -lexible PCBs, ceramic boards aluminum PCBs high precsion impedance boardsSMT and other specia boards Aso proide OEM sevice 。 suface teatment ;induding PCE imesion gald electoytic nicke gold gold finge electoyfi :sof :gold electoyi :hid gld ENEPIG lead free HASI .and immersion sile etC,